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US Patent Issued to Innolux on April 14 for "Electronic device having opaque layer with opening for light transmission" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,773, issued on April 14, was assigned to Innolux Corp. (Miaoli County, Taiwan). "Electronic device having opaque layer with opening for li... Read More


US Patent Issued to Innolux on April 14 for "Electronic device having opaque layer with opening for light transmission" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,773, issued on April 14, was assigned to Innolux Corp. (Miaoli County, Taiwan). "Electronic device having opaque layer with opening for li... Read More


US Patent Issued to Infineon Technologies on April 14 for "Electrical connection element and correspond method and apparatus with outgassing grooves that remove trapped gasses" (Philippine, Malaysian, German Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,774, issued on April 14, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Electrical connection element and correspond meth... Read More


US Patent Issued to Infineon Technologies on April 14 for "Electrical connection element and correspond method and apparatus with outgassing grooves that remove trapped gasses" (Philippine, Malaysian, German Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,774, issued on April 14, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Electrical connection element and correspond meth... Read More


US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor chip and semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,775, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor chip and semiconductor packa... Read More


US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor chip and semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,775, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor chip and semiconductor packa... Read More


US Patent Issued to AUO on April 14 for "Luminous panel" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,776, issued on April 14, was assigned to AUO Corp. (Hsin-Chu, Taiwan). "Luminous panel" was invented by Tzu-Chun Lin (Hsin-Chu, Taiwan), S... Read More


US Patent Issued to AUO on April 14 for "Luminous panel" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,776, issued on April 14, was assigned to AUO Corp. (Hsin-Chu, Taiwan). "Luminous panel" was invented by Tzu-Chun Lin (Hsin-Chu, Taiwan), S... Read More


US Patent Issued to FUJI ELECTRIC on April 14 for "Semiconductor module" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,777, issued on April 14, was assigned to FUJI ELECTRIC Co. LTD. (Kanagawa, Japan). "Semiconductor module" was invented by Ryo Nomaguchi (M... Read More


US Patent Issued to FUJI ELECTRIC on April 14 for "Semiconductor module" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,777, issued on April 14, was assigned to FUJI ELECTRIC Co. LTD. (Kanagawa, Japan). "Semiconductor module" was invented by Ryo Nomaguchi (M... Read More